MechScience: For mechanician & mechanical science

the 2nd International Conference on Intelligent Robotics and Applications (16 - 18 December, 2009, Orchard Hotel, Singapore)

website：http://icira2009.robotics.sg/index.php

Important Dates:

Preliminary Announcement：15 November 2008
First Call for Papers ： 15 December 2008
Second Call for Papers ： 15 February 2009
Submission of Full Papers ： 15 June 2009
Paper Acceptance ： 15 August 2009
Submission of Final Papers ： 15 September 2009
Early Bird Registration ： 30 September 2009
Technical Program ： 30 September 2009
Conference ：16 - 18 December 2009

WorldWide Electroactive Polymer Actuators* Webhub
http://eap.jpl.nasa.gov/

This homepage provides links to various electroactive polymer (EAP) websites worldwide and it is maintained by the JPL's NDEAA Technologies Lab. For background information please see a lecture on video entitled "Electroactive Polymers as Artificial Muscles" or see the following article [Keynote Presentation at the Robotics 2000 and Space 2000, NM, USA] entitled: "EAP as Artificial Muscles - Capabilities, Potentials and Challenges". The field of EAP is part of the broader field of biomimetics

In 1999, Dr. Bar-Cohen posed a challenge to the worldwide research and engineering community to develop a robotic arm that is actuated by artificial muscles to win an armwrestling match against a human opponent. The first Armwrestling Match between EAP actuated Robot and Human (AMERAH) was held on March 7, 2005 as part of the 2005 SPIE Annual International EAPAD (EAP Actuators & Devices) Conference. This match was organized with assistance from the United States ArmSports who provided the table for the match. There were three participating organizations including Environmental Robots Incorporated (ERI), New Mexico; Swiss Federal Laboratories for Materials Testing and Research, EMPA, Dubendorf, Switzerland; and three senior students from the Engineering Science and Mechanics Dept., Virginia Tech. The human opponent is Panna Felsen, a Straight-A high school student from San Diego. Panna won against all the three robotic arms where the ERI made arm managed to last 26-seconds before losing while the other two managed to hold for 4 and 3 seconds, respectively. Even though they did not win, this has been a very important milestone for the field. To draw analogy from aerospace, one may want to remember that the first flight lasted about 12 seconds. A video of the competition is available on the Discovery channel's Daily Planet, March 15, 2005.

Organic transistors manufactured using inkjet technology with subfemtoliter accuracy
A major obstacle to the development of organic transistors for large-area sensor, display, and circuit applications is the fundamental compromise between manufacturing efficiency, transistor performance, and power consumption. In the past, improving the manufacturing efficiency through the use of printing techniques has inevitably resulted in significantly lower performance and increased power consumption, while attempts to improve performance or reduce power have led to higher process temperatures and increased manufacturing cost. Here, we lift this fundamental limitation by demonstrating subfemtoliter inkjet printing to define metal contacts with single-micrometer resolution on the surface of high-mobility organic semiconductors to create high-performance p-channel and n-channel transistors and low-power complementary circuits. The transistors employ an ultrathin low-temperature gate dielectric based on a self-assembled monolayer that allows transistors and circuits on rigid and flexible substrates to operate with very low voltages. 更多阅读（英文）PNAS发表论文摘要

more about All-inkjet-printed flexible electronics and its manufacturing.

新喷墨技术可提高晶体管性能：科学家们最近开发出一种新的喷墨技术，其喷射出的墨点比一般机器的小一千倍，因此可以在软性塑料微芯片上打印出只有微米大小的银布线。这一新技术的应用不仅可以降低微芯片的制作成本和能源消耗，还可以提高晶体管的性能。相关论文发表在美国《国家科学院院刊》（PNAS）上。
Tsuyoshi Sekitani所在的研究小组对喷墨打印机的打印头施加高电压，从而使机内的墨点爆裂成直径大约一微米的小型墨点。通过使用由纳米银粒子和有机溶剂组成的墨水，研究人员成功地连续打印出仅两微米宽的银布线，尽管就当前的微处理器标准来说这一尺寸并不小，但是这已经可以满足一些简单的应用，比如柔性显示器。为在精细的有机晶体管层上打印，更小尺寸的墨点比现有的墨水更为安全。有机晶体管层是塑料微芯片的基础，若墨点的尺寸减小，墨水中具有潜在破坏性的溶剂会蒸发得更快。研究人员还发现，增压喷墨打印头打印出的银布线会在130摄氏度的时候熔化，而一般的喷墨打印机打印出的银布线需要150摄氏度，相比之下，更低的温度可以保证有机晶体管不会同时受损。研究人员利用这种新型技术制造出了可用的有机回路，上面布满了间距一微米的平行银布线，这是迄今为止打印出的晶体管中最小的活动“沟道”区。（来源：EurekAlert!中文版） http://www.sciencenet.cn/htmlpaper/20083251453395311590.html
（《国家科学院院刊》（PNAS），doi：10.1073/pnas.0708340105，Tsuyoshi Sekitani，Takao Someya）

The 2008 International Conference on Intelligent Robotics and Applications (ICIRA 2008) was the first event in this conference series. These two volumes constitute the refereed proceedings of the First International Conference on Intelligent Robotics and Applications, ICIRA 2008, held in Wuhan, China, in October 2008. In this conference, I acted as a secretary-general.
After the success of the inaugural conference, the purpose of the 2nd International Conference on Intelligent Robotics and Applications (16 - 18 December, 2009, Orchard Hotel, Singapore) is to provide a venue where researchers, scientists, engineers and practitioners throughout the world can come together to present and discuss the latest achievement, future challenges and exciting applications of intelligent and autonomous robots.
link: http://www.chinamaker.org/2008/11/proceedings-intelligent-robotics-and.html

The 265 revised full papers presented were thoroughly reviewed and selected from 552 submissions; they are devoted but not limited to robot motion planning and manipulation; robot control; cognitive robotics; rehabilitation robotics; health care and artificial limb; robot learning; robot vision; human-machine interaction & coordination; mobile robotics; micro/nano mechanical systems; manufacturing automation; multi-axis surface machining; realworld applications.Two proceedings: Part I: Intelligent Robotics and Applications. Xiong, C., Liu, H., Huang, Y. (et al.) (Eds.), 2008 ... More. Part II: Intelligent Robotics and Applications. Xiong, C., Liu, H., Huang, Y. (et al.) (Eds.), 2008 ... More

ICIRA 2008 was advocated by the International Workshop on Robotic Grasping and Fixturing in June 2007, Wuhan, China. Robotics research, however, involves a wide spectrum of research and applications from the first industrial manipulator to Mars rovers, and from surgery robotics to cognitive robotics. Industrial and real-world applications are the force driving the research frontier further forward. The aim of the ICIRA 2008 conference is to promote interactions and collaborations between disciplines, which are beneficial in bringing fruitful solutions to the forefront, and to be an international forum that brings together those actively involved in intelligent robotics and applications.
These volumes of Springer’s Lecture Notes in Artificial Intelligence and Lecture Notes in Computer Science contain papers accepted for presentation at ICIRA 2008, held in Wuhan, China, October 15–17, 2008. The conference received 552 submissions from all over the world, which were subsequently peer refereed by the Program Committee, with the assistance of external referees. Among them, 265 high-quality papers were accepted for presentation at the conference, covering the most active topics on intelligent robotics such as robot cognition, robot learning, robot vision, motion planning, multifingered manipulation and intelligent control. Advances in robotized equipments applied in rehabilitation and medical robotics, health care and artificial limbs, digital manufacturing, electronic manufacturing, and manufacturing automation are also reported. The authors come from the following countries and regions: Australia, Austria, China, France, Germany, Hong Kong, Iran, Italy, Japan, Korea, Malaysia, Poland, Romania, Singapore, Slovakia, Spain, Sweden, Switzerland, Taiwan, UK, and USA. In addition, ICIRA 2008 held a series of plenary talks, where we were fortunate to have such keynote speakers as Peter Luh, Tianmiao Wang, Jiping He, and Jun Wang, who shared their expertise with us in diverse topic areas spanning the range of intelligent robotics and application activities.
The Chinese News of ICIRA 2008 can be found at http://www.hust.edu.cn/content/content_25647.html.
The vedio of ICIRA 2008 can be browsed at http://tv.hustonline.net/html/2008-10-24/54800.shtml.

A new report published today identifies and describes research and development priorities for the future of three critical, high-tech U.S. manufacturing areas – hydrogen energy technologies, nanomanufacturing, and intelligent and integrated manufacturing. The report, Manufacturing the Future: Federal Priorities for Manufacturing R&D, was prepared by the Interagency Working Group (IWG) on Manufacturing R&D of the National Science and Technology Council’s (NSTC) Committee on Technology.
"Our objective was to focus on issues of national importance, and to identify manufacturing areas that have the potential to deliver major benefits to the economy," said David Stieren, executive secretary of the group that produced the report and technology deployment manager of the Commerce Department's National Institute of Standards and Technology (NIST) Hollings Manufacturing Extension Partnership. "These benefits include creating new jobs, enhancing manufacturing competitiveness and making progress toward accomplishing major national goals,” he said.
Competing successfully in today’s fast-paced global community requires rapid innovation, research and production methods to cost-effectively bring products to market. The report describes the significance of each of the three critical manufacturing R&D areas, details the challenges essential for progress, discusses existing interagency collaborations and provides recommendations for future research.
The report cites these manufacturing areas as being important to U.S. economic and national security. It identifies these areas as potentially leveraging scientific and technological advances to transform knowledge and materials into valuable products. Much of this research falls under the American Competitiveness Initiative, a government-funded mandate to increase investments in R&D, education and entrepreneurship. These manufacturing areas also correspond to existing priorities established by the federal government through the President’s Hydrogen Fuel Initiative, the National Nanotechnology Initiative, and the Networking and Information Technology Research and Development Program.

Three Key R&D Priorities for Future Manufacturing
Manufacturing the Future: Federal Priorities for Manufacturing R & D identifies these three critical high-tech U.S. manufacturing areas and the interdependencies between them as R&D priorities for the future.
Manufacturing R&D for Hydrogen Energy Technologies
In order to improve energy security and clean air, the U.S. government is committed to replace petroleum with alternative energy technologies including hydrogen to power cars and light trucks. Meeting this challenge requires developing low-cost, high-volume manufacturing processes to produce affordable and reliable fuel cell vehicle technology and to build and maintain a hydrogen fuel infrastructure. Other manufacturing challenges include standardizing components and systems design for production, overcoming the technical problems of delivering hydrogen and mass producing fuel cells, and developing high-volume storage tanks.
Nanomanufacturing
Nanotechnology is expected to be a critical driver of future economic growth, affecting potentially every industry from aerospace and energy to health care and agriculture. Nanomanufacturing encompasses industrial-scale production of materials, structures, devices, and systems with nanoscale components whose unique properties derive from engineering at the nanoscale (roughly 1 to 100 nanometers or billionths of a meter). In order for nanomaterials to be mass produced reliably and affordably, scientists and engineers have to overcome hurdles relative to developing top-down processes (miniaturizing devices and structures to their smallest possible sizes) and bottom-up approaches (building nanostructures and nanodevices from the ground up by using tiny building blocks).
Intelligent and Integrated Manufacturing R&D
Information technology can reshape almost all features of manufacturing, from product development and design, through distribution and customer support. Intelligent and Integrated Manufacturing applies computer software, controls, sensors, networks and other information technology to the entire process. This includes using software to rapidly design and test new products, or linking “smart” supply chains to make sure there are always enough raw materials to build products and efficient methods to get them to customers on time. These computer-enhanced processes are central to creating a hydrogen-powered economy, improving national security, developing innovative real-world applications of nanotechnology and to other national goals for the future. Increasing computing power and the availability of inexpensive sensors and network devices opens the door to designing new processes to optimize capabilities, performance and value.
Interdependencies
These three research sectors are also interdependent. For example, the design and cost-effective production of nanomaterials to store hydrogen may be critical to our country’s transition away from an oil-dependent transportation system. Also, intelligent, flexible manufacturing may reduce the time and cost of incorporating nanoscale components into real world applications, according to the report. Finally, the three research sectors offer an opportunity to contribute to sustainable manufacturing by incorporating materials, processes, and systems that use energy and materials effectively and use environmentally preferable materials.

After the success of the inaugural conference, the purpose of the 2nd International Conference on Intelligent Robotics and Applications (16 - 18 December, 2009, Orchard Hotel, Singapore) is to provide a venue where researchers, scientists, engineers and practitioners throughout the world can come together to present and discuss the latest achievement, future challenges and exciting applications of intelligent and autonomous robots. In order to benefit all participants, and also to maximize the interaction, the technical program of this conference is intentionally tailored to having relatively few parallel tracks. Each track will accommodate peer-reviewed articles dealing with theoretical, experimental and applicative works. In addition to the technical program, the conference will include several keynote speakers and a common poster session.
The market demands for skills, knowledge and personalities have positioned robotics to be one important field in both engineering and science. In order to meet these challenging demands, robotics has already seen its success in automating many industrial tasks in factories. And, a new era will come for us to see a greater success of robotics in non-industrial environments. In order to anticipate a wider deployment of intelligent and autonomous robots for tasks such as manufacturing, eldercare, homecare, edutainment, search and rescue, de-mining, surveillance, exploration, and security missions, it is necessary for us to push the frontier of robotics into a new dimension, in which motion and intelligence play equally important roles.
More about the first International Conference on Intelligent Robotics and Applications can be found here.
Jointly organized by Nanyang Technological University, Huazhong University of Science and Technology, National University of Singapore, and Singapore Polytechnic.

根据中国力学学会第八届理事会第4次全体常务理事会关于同意设立“微纳米力学工作组”和“电子电磁器件力学工作组”的决议，日前，以郑泉水为组长的“微纳米力学工作组”和以王骥为组长的“电子电磁器件力学工作组”的2个工作组已正式设立，其工作组成员名单也一并讨论通过。
随着硅时代日益趋向极限，微电子产业逐步深入到纳米尺度， 微纳米力学属于新兴交叉学科，研究内容与物理、化学、生物、材料、精密制造等密切交叉。在我国众多大学、研究所的力学工作者已经掀起了与微纳米力学相关的研究热潮，不仅在国际上取得了一些高显示度的研究成果，而且形成了一支基础素质较高的研究队伍。“中国力学学会微纳米力学工作组”将组织、引导我国力学工作者有效参与纳米科技研究，促进我国微纳米固体、流体和生物力学的交叉研究，促进纳米科技时代力学与相关工程学科和基础学科的深度交流，促进国内和国际相关领域的学术交流。
电子和电磁器件在现代高科技中起着十分关键的甚至核心的作用，产品种类繁多，应用十分广泛，在其设计、制造和运用中都孕育着大量的的力学问题，为力学工作者提供了丰富且十分具有挑战性的研究课题。“中国力学学会电子电磁器件力学工作组”的设立将有助于力学这一传统学科新兴的电子、传感器、智能结构、微机电系统（MEMS）、精密仪器、生命科学、新材料和新能源等重要领域和行业的交融和合作。

Welcome address from the Chairman:On behalf of the organizing committee, I would like to invite you to participate in the International Conference on Nanoscience and Technology, China 2009 (ChinaNANO 2009) which will be held between September 1-3, 2009 in Beijing, China. This is the third conference following ChinaNANO 2005 and ChinaNANO 2007 held in 2005 and in 2007 in Beijing, respectively. ChinaNANO 2009 is intended to stimulate discussions on the forefront of research in nanoscience and technology. The conference will focus on nano-information materials, nano-energy and environmental materials, nano-devices and sensors, nano-medicine, nano-pharmacy and biomedical engineering, nano-fabrication, characterization of nanostructures, nano-optics and plasmonics, and modeling and simulation of nanostructures. We sincerely hope that the scope of the conference will serve the interest of the scientific community, as well as the industry and the general public. I wish to extend my welcome to all participants and sponsors of the event.
Looking forward to meeting you in Beijing in 2009
With best wishes I remain,
Chunli BaiChairman, Organizing Committee of ChinaNANO 2009Executive Vice President, Chinese Academy of SciencesChairman, Council of National Center for Nanoscience and Technology, China
在科技部、教育部、国家自然科学基金委员会、中国科学院、中国科协及其它部委的大力支持下，2005年和2007年，国家纳米科学中心成功举办了2005年中国国际纳米科学技术会议（简称：ChinaNANO 2005）和2007年中国国际纳米科学技术会议（简称：ChinaNANO 2007），分别吸引了来自40多个国家和地区的600多名和1000多名代表参加会议，在国内外学术界引起了较大的反响。为把ChinaNANO发展成为纳米科学技术领域的品牌会议，使其成为中国科学家与国际学术界交流沟通的桥梁，推动我国纳米科学技术研究的发展，国家纳米科学中心拟于2009年9月1-3日，在北京举办2009年中国国际纳米科学技术会议（简称：ChinaNANO 2009），中国科学院常务副院长白春礼院士担任大会主席。

一、会议名称
中文名称：2009年中国国际纳米科学技术会议
英文名称：International Conference on Nanoscience and Technology, China 2009（简称：ChinaNANO 2009） 会议网站：http://www.chinanano.org/
二、会议内容
1.纳米信息材料
2.纳米能源与环境材料
3.纳米器件与传感器
4.纳米医药与纳米生物技术
5.纳米加工
6.纳米结构表征
7.纳米光学与表面等离基元学
8.纳米结构的模拟计算
三、大会组委会
大会主席：白春礼
副 主 席：解思深 王中林
秘 书 长：朱 星
副秘书长：王 琛 查连芳
四、会议规模与形式
1、会议规模预计600人，境外代表270人，会期3天。
2、大会设立大会特邀报告、分会特邀报告、一般口头报告和墙报。
五、会议论文集将由美国科学出版社在“Journal of Nanoscience and Nanotechnology”期刊上发表
六、联系方式
联系人：汲志华 电话：010--62652116 传真：010--62656765
E-mail: chinanano@nanoctr.cn

The exponential growth in integrated device density has yielded high-performance microprocessors containing almost 1 billion transistors per chip for the current 65 nm technology, up to now it is maybe 45nm technology. Continuous scaling of the devices and performance requires innovations in materials, processes, and designs for both back-end-of-line (BEoL) interconnects and packaging structures. Mechanical reliability has been a limiting factor for implementation of new materials and processes[1]. Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill. Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial[2].
It does not need to emphasize how important it is for our world, especially for academics to go out of papers and books. In the area of the mechanics of interconnects, Zhigang Suo recommanded two particular works in his blog. If you want to get into this research field, studying them might give a perspective. There two works are listed as following[1]:
R.H. Dauskardt, M. Lane, Q. Ma and N. Krishna, Adhesion and debonding of multilayer thin film structures. Engineering Fracture Mechanics 61, 141-162 (1998). This paper developed the 4-point bending method. Although the mechanics and the technique themselves were already known at the time, the collaboration between Reiner Dauskardt, of Standford, and Qing Ma, of Intel, really reduced the interfacial fracture mechanics to industrial practice. Their method is now widely adopted in the industry. This work has markedly enhanced the appreciation of fracture mechanics in the microelectronic industry.
M.A. Korhonen, P. Borgesen, K.N. Tu, and C.Y. Li, Stress evolution due to electromigration in confined metal lines. J. Appl. Phys. 73, 3790 (1993). This is a work resulting from a collaboration between Cornnel and IBM. Again, much of the basic ingredients was known when this paper was published. But the authors put the ingredients together, and clearly linked electromigration to the mechanical behavior of the interconnect structure. This paper has become the foundation of subsequent analysis of electromigration.
Both of these works remain important as we study low-k interconnect structures. Resouces to learn about challenges in the semiconductor industry:
International Technology Roadmap for Semiconductors. On this site you can download the famous Roadmaps, the industrial consensus of how to reach the moving target. The target, of course, has been to make Moore's law real. The Roadmaps spell out future needs of the industry, which drive today's research and development.
JEDEC. The developer of standards for the solid-state industry. All publications are free online. For example, JEP112 is entitled "Failure Mechanisms and Models for Silicon Devices".
to be continued
[1] http://www.imechanica.org/node/2880
[2] Electronic Assembly Fabrication : Chips, Circuit Boards, Packages, and Components

There are many free mechanical luctures.http://worldofmz.blogspot.com/search/label/Mechanical. The following is main content, please click ther linkage and enjoy it.
Prof. Wei Huang UC San Diego Spring 2008 submitted on 14 April, 2008
Introduction to Solidification Processing
Graduate Institute of Ferrous Technology submitted on 2 April, 2008
Solidification processing, Structure and properties of liquid metals, Heat and mass transfer, Heat management, Thermodynamics of solidification, Kinetics of solidification, Fluids flow, Semisolid metal processing etc...

Finite Element Analysis
Prof. H. K. D. H. Bhadeshia University of Cambridge submitted on 2 April, 2008
Introduction and elastic analyis, Thermal analysis.

Modelling of Phase Transformations in Steels
Prof. H. K. D. H. Bhadeshia Graduate Institute of Ferrous Technology (GIFT) submitted on 2 April, 2008
Atomic Mechanisms,Allotriomorphic and Idiomorphic Ferrite, Thermodynamics, Kinetic Theory, High-Strength Steels, Computer Calculation of Phase Diagrams etc...

Metals and Alloys
H. K. D. H. Bhadeshia University of Cambridge submitted on 2 April, 2008
Atomic Diffusion, Solidification, Recovery, Recrystallization, Grain Growth, Martensitic Transformations, Ferrous Alloys, Metallic Materials, High Temperature Alloys etc...

introduction to Electronic Structure and Thermodynamics Calculations of Real Materials
University of Illinois 2005 submitted on 2 April, 2008
Overview of Electronic Structure theory and methods including Density Functional Theory. Alloy Electronic Structure, Structural Formation Energies, and Preliminaries of Cluster Expansion Hamiltonians, etc...

Mechanics in light of cell biology
prof Taher Saif, Mechanical Science and Engineering, University of Illinois

Structural Aspects of Biomaterials & Lab
UC Berkeley spring 2007
This course covers the mechanical and structural aspects of biological tissues and their replacements. Tissue structure and mechanical function are addressed. Natural and synthetic load-bearing biomaterials for clinical and medical applications are reviewed. Biocompatibility of biomaterials and host response to structural implants are examined. Quantitative treatment of biomechanical issues and constitutive relationships of tissues and biomaterials etc...

Discrete Event Simulation
UC Berkeley spring 2007
Introductory course on design, programming, and statistical analysis of a simulation study. Topics include the types of problems that can be solved by such methods. Programming material includes the theory behind random variable generation for a variety of common variables. Techniques to reduce the variance of the resultant estimator and statistical analysis are considered.

Fluid Mechanics
UC Berkeley spring 2007
Elementary Fluid Mechanics, Fluid Kinematics, Integral Analysis, Differential Analysis, Dimensional Analysis, Similarity, Channel, external, compressible flow etc...

Video Demonstrations of Solid Mechanics and Materials
Video Demonstrations of Mechatronics Principles
actuators, circuit examples, data acquistion, electrical components and measurements, mechatronic system examples, PIC microcontroller examples, PIC microcontroller student design projects, power transmission, sensors etc...

Fluids Laboratory
The University of Iowa
Introduction to Fluid motion, Fundamental principles of flow, Laminar and turbulent flow, Fluid motion in gravitational field, Form drag, lift and propulsion, effects of fluid compressibility.

Introduction to Engineering
The University of Massachusetts Lowell Fall 2007

Project management
New Jersey Institute of Technology

Computer Control of Machines & Processes
University of Wisconsin, Madison : Mechatronics Lab
Overview, Open-loop and Closed-loop Controls, Matlab Basics, Computer architecture, Input/Output, Discrete Process & Controller Modeling, Sequential Logic Control, Data Sampling, State Transition Diagrams, Laplace & Z-transforms, Discrete & steady state response, Final vale theorem, Stability, Root locus, Aliasing, System Design Example etc...

Phase Transformations: Metals and Alloys
University of Cambridge,
Atomic Diffusion, Solidification, Recovery, Recrystallisation & Grain Growth, Martensitic Transformations, Ferrous Alloys, Metallic Materials and High Temperature Alloys etc...

Atomistic Computer Modeling of Materials
MIT Spring 'o5, streaming
Introduction; Potentials, Supercells, Relaxation and Methodology; Potentials for Organic Materials and Oxides; Energy Methods: Hartree-Fock and DFT; Density Functional Theory; Stat Mech and Thermodynamics; Molecular Dynamics; Monte Carlo Simulations: Lattice Models, Metastability; Free Energies and Physical Coarse-Graining; Model Hamilton ions etc....

Symmetry, Structure, and Tensor Properties of Materials
MIT, Fall '05, Streaming
Crystallography; Crystalline Structure and Geometry; Translation, Rotation and Periodicity; 2D Symmetries, Plane Groups and Lattices; Diffraction, 3D Symmetries; Physical Properties of Crystal Structures; Space Group notation; Stress , Strain, Sheer and Thermal Expansion Tensors; Piezoelectricity etc....

Properties of Materials
Berkely Fall 'o6, Audio streaming & Download
History; Quantum Mechanics & Electronics; Hydrogen Crystal Model; Corrosion; Material Interface Potential Drops; Oxidation & Reduction Potentials; Crystallographic Idices and Solid Phases; Entropy; Diffusion & Energy; Phase Diagrams and Statistical Mechanics & Composition; Phase Fractions; Microstructures; Mechanical Deformation & Crystal Imperfections; Dislocations & Strength; Dielectrics & Polymer Breakdown etc....

Mechanical Engineering Design
Berkely Fall 'o6, Audio streaming & Download
Microprocessors and Labs; Power Screw & Fastner; Bolt & Preload; Fatigue Loading; Rolling-Contact Bearings; Gears; Gear Train and Force; Motors; etc...

Heat Transfer
Berkely Fall 'o6, Audio streaming & Download
Introduction; Heat Conduction, Fourier Law, Governing Equations; 1-D & 2-D Steady State Heat Conduction; Resistance Networks; Fins; Transient Heat Conduction: Lumped Capacitance & Analysis; Convection; Internal & External Flows; Heat Exchangers, LMTD Method; Radiation, Black Body; Radiative Exchange Between Black and non-Black Surfaces; Boiling & Condensation etc....

Nano-to-Macro Transport Processes
MIT Fall 'o4, Audio streaming & Download
Introduction to Nanotechnology and Nanoscale Transport Phenomenon; Time and Length; Kinetic Theory; Schrodinger Equation; Quantum Wells; Harmonic Oscillators, Rigid Rotors; Crystals; Nanostructures; Waves; Laudauer Formalism; Louiville Equation; Fourier Law and Newton’s Shear Stress Law; Ohm’s Law and Thermoelectric Effect. Classical Size Effects; Brownian Motion, Electrokinetics and Surface Tension etc....
thank iMechanica

I'm pleased to shear several websites of mechanics with mechanican, and new websites will be add continually. The names and their links are listed as following:

1. U.S. National Committee on Theoretical and Applied Mechanics http://www7.nationalacademies.org/usnctam/


2. The American Academy of Mechanics http://www.aamech.org/


3. iMechanicaweb of mechanics and mechanicians http://www.imechanica.org/


4. PoroNet: Poromechanics, Poroelasticity, Porous Materials http://www.olemiss.edu/sciencenet/poronet/index.html


5. MechScienceweb of mechanicians and mechanical science http://www.mechscience.com/


6. Chinese Society of Theoretical and Applied Mechanics http://www.cstam.org.cn/


7. CFD Online http://www.cfd-online.com/


8. eFluids http://www.efluids.com/


9. Biocurious http://biocurious.com/


10. IUTAM http://www.iutam.org/


11. AFMC Asian Congress of Fluid Mechanics http://www.afmc.org.cn/


12. European Society of Biomechanics (USB) http://www.utc.fr/esb/


13. NSF Directorate for Engineering http://www.eng.nsf.gov/


14. Institute of Mechanics (IMECH), Chinese Academy of Sciences http://www.imech.ac.cn/


15. Meshfree Methods http://meshfreemethods.blogspot.com/


16. Multi-Scale Manufacturing & Characterisation http://nt-542.aeromech.usyd.edu.au/msmc/solmec/framec.html


17. http://nanotechweb.org/cws/home


18. The following are several samples of Wikipedia entries on mechanics.

• Applied mechanics. This entry describes mechanics in the context of applications.


• Mechanics. This entry serves as a gateway to various branches of mechanics.


• Mechanician. This entry describes who are mechanicians, and points to historical figures in our field.


• Timoshenko medal. This entry describes the medal and points to short sketches of medallists.


• Applied Mechanics Division. This entry describes this Division of the American Society of Mechanical Engineers.

ScienceDirect is not strange to us. If you want to find more about it, you can click here(ScienceDirect Info site). When your university buy the database of ScienceDirect, you can download many valuable papers and books. There are more than 2500 Journals and 6000 books. What you can download is determinated by the right of your university. According to the author's knowledge, most of the university in China can download the paper from 1995 to present, and have no right to book.
Besides the above, there are much free information. Now I list some of the useful imformation as follows:
(1)I think the Top25 is one of the most useful tool, by which You can know what is top 25 attentional papers in big class, such as Engineering and Physics, also top 25 papers of a certain journal, such as Microelectronics and JMPS. Now you can keep track of the latest trends and developments in your speciality with ScienceDirect's TOP25. The TOP25 is a free service which provides top 25 lists of most read articles http://top25.sciencedirect.com/index.php
(2)The "Alert me about new Journal Issues" is another useful for you, especially when you are very busy and have no time to browse ScienceDirect. When you have used this tool, you will receive aperiodically the new information about the journal you care about.
(3)You can export the paper's basic information to your reference manager, such as Endnote which a very convenient for you in paper writing. It can save your much time and decrease the input mistake greatly.
(4)"Citation Alerts" is very useful when you want to know who citate your paper.
(5)"Topic Alerts" give you the latest paper of your research field. And it will send the information to Email.
(6)Want to know more? The ScienceDirect Info site has all the information you need to help you make the most of ScienceDirect. Online tutorials in multiple languages are also available. Guide in Simpe Chinese can be down directly by clicking here.
(7)Scopus Overview: What is it? Scopus is the largest abstract and citation database of research literature and quality web sources. It's designed to find the information scientists need. Quick, easy and comprehensive, Scopus provides superior support of the literature research process. Updated daily, Scopus offers. Scopus is the easiest way to get to relevant content fast. Tools to sort, refine and quickly identify results help you focus on the outcome of your work. You can spend less time mastering databases and more time on research. Scopus Help.
If you have any questions, you can google it or baidu it.

About Scopus TopCited

Get a quick overview of your subject-specific top 20 cited articles in the past 3, 4 or 5 years of publication. Also find them displayed on Google maps taking the first author’s affiliation as the point of reference.
As a subscriber to Scopus you can click through to the abstract for each of the top 20 results and access the full text depending on the entitlements of your institute.
If you do not have access to Scopus, view the results on the Scopus preview pages or sign up for a free 30 day trial.
TopCited retrieves all data via the Scopus Search API. Benefit utilizing Scopus data and build your own TopCited or other API mashups by requesting a developer key.
TopCited is powered by Scopus, the largest abstract and citation database of peer-reviewed literature and quality Web sources .

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• Scopus TopCited in Mainland

Computational Methods for Coupled Problems in Science and Engineering-COUPLED PROBLEMS 2009
8-11 June 2009, Ischia Island, Italy. The objective of Coupled Problems 2009 is to present and discuss state of the art, mathematical methods, numerical methods and computational techniques for solving coupling problems of multidisciplinary character in science and engineering. Emphasis will be given on showing the potential of new computational methods for solving practical multidisciplinary problems of industrial interest.
Previous editions on the conference were held in the Island of Santorini, Greece (2005) and Ibiza, Spain (2007), Coupled Problems 2007 attracted some 180 participants. The goal of COUPLED PROBLEMS 2009 is to make a step forwards in the formulation and solution of real life problems with a multidisciplinary vision accounting for all the complex couplings involved in the physical description of the problem.
Location:
ISCHIA is the biggest island in the Gulf of Naples, a volcanic island in the Tyrrhenian Sea, at the northern end of the Gulf. The history of the known as "green island" is marked by earthquakes and eruptions. Ischia is the visible part of a volcanic field. Its volcanic activities began more than 130,000 years ago. The highest peak, volcanic, is the Mount Epomeo (788 meters).
Important Dates:Deadline for presenting one page abstract: 30 October 2008Acceptance of the contributions and instruction: 28 November 2008Deadline for submitting the final contribution: 27 February 2009Booking of hotel accommodation: as soon as possible
Homepage: http://congress.cimne.upc.es/coupled09/frontal/default.asp

Nanomanufacturing is the controllable manipulation of materials structures, components, devices, and systems at the nanoscale (1 to 100 nanometers) in one, two, and three dimensions for large-scale reproducibility of value-added components and devices. Nanomanufacturing remains the essential bridge between the discoveries of the nanosciences and real-world nanotechnology products.
Advancing nanotechnology from the laboratory into high-volume production ultimately requires careful study of manufacturing system issues including product design, reliability and quality, process design and control, shop floor operations and supply chain management. Nanomanufacturing encompasses bottom-up directed assembly, top-down high resolution processing, molecular systems engineering, and hierarchical integration with larger scale systems. As dimensional scales of materials and molecular systems approach the nanoscale, the conventional rules governing the behavior and properties of these components, devices, and systems change significantly. As such, the behavior of the final product is enabled by the collective performance of the nanoscale building blocks.
More disscussion can be found in http://www.mechscience.com/?q=node/87.

Research Challenges
The challenges facing nanomanufacturing systems integration represents an inherently multi-disciplinary set of problems addressing issues for working with structures in the 0.1-100 nm regime that must combine the range of top-down and bottom-up processes available in order to provide multi-scale systems integration. To achieve the necessary economy of scale for large-scale production, new concepts and principles must be envisioned providing revolutionary approaches, thereby extending the capabilities of existing manufacturing and infrastructure. A cross-section of scientific disciplines is contributing to the greater understanding and control of nanoscale phenomena—physics, chemistry, biology, material and information sciences, engineering, and polymer science. The collective knowledge of these disciplines will redefine the relationships between materials, processes and property phenomena, allowing for the creation of revolutionary nanomanufacturing techniques. Those techniques will help to bridge the manufacturing gap between the innovations of the research laboratory and the economic viability of nanotechnology.
The critical challenges for nanomanufacturing are the need to control assembly of three-dimensional heterogeneous systems; to process nanoscale structures in high-rate/high-volume applications without compromising their inherent properties; and to ensure the long-term reliability of nanostructures through testing and metrics. These challenges reflect the need for research in the characterization of nanomaterials and nanoparticles as the building-blocks of nanostructures, and in the fabrication and synthesis of both top-down and bottom-up processes. Further, they require advanced instrumentation to characterize and measure nanostructures, to provide predictive simulation of nanostructure behavior, and to contribute to the design and integration of nanodevices and systems. Finally, knowledge sharing and outreach is a challenge to be overcome to enable technology transfer and to contribute to public awareness of nanotechnologies.

Context
Much of the momentum for nanomanufacturing emanates from the semiconductor industry, where the push to create smaller, faster, and more efficient microprocessors has heralded the creation of circuitry less than 100 nanometers in size.
Federally, the National Nanotechnology Initiative (NNI) is a cross-departmental program that has been working since 2001 to support and advance the development of nanotechnologies in the United States. The NNI has identified nanomanufacturing as one of seven Program Component Areas and, in 2006, earmarked $47 million for research in this domain. Also since 2001, the National Science Foundation (NSF) has funded four Nanoscale Science and Engineering Centers explicitly focused on manufacturing.
With nearly 60 federally funded research centers under NNI governance and over 1200 nanotech companies based in the USA as of 2006, the drive to move nanotechnology from laboratory to marketplace is strong.
Areas of application for nanomanufacturing include:
Electronics and Semiconductor Industries
IT and Telecommunications
Aerospace and Automotive Industries
Energy and Utilities
Materials and Chemical Industries
Forest and Paper Products
Food Industries
Pharma, Biomed and Biotechnology
Environment and National Security
Clothing and Personal Care
References
Busnaina, Ahmed. Nanomanufacturing Handbook. Boca Raton, FL: CRC Press/Taylor & Francis; 2007, 1-31.
Biscarini, Fabio, et al. “Nanomanufacturing and Processing—Research, Education, Infrastructure, Security, Resource.” Journal of Manufacturing Science and Engineering 124 (2002) 489-490.
Haris Doumanidis. “The Nanomanufacturing Programme at the National Science Foundation.” Nanotechnology 13 (2002) 248-252.
NSET Subcommittee, Committee on Technology. The National Nanotechnology Initiative: Research and Development Leading to a Revolution in Technology and Industry—Supplement to the President’s 2006 Budget. National Nanotechnology Initiative. March 2005.
Karen F. Schmidt. Nanofrontiers: Visions for the Future of Nanotechnology. Woodrow Wilson International Center for Scholars Project on Emerging Nanotechnologies. March 2007.
Nanovip.com, the International Nanotechnology Business Directory. Accessed 7/26/07 http://www.nanovip.com/.
Come from InterNano

For over half of century, the technology of microelectronics has been advancing by miniaturization, leading to significant increases in computing power and continuous decreases in manufacturing cost. In parallel, remarkable progress on enlarging system scale in recent years gives rise to a nascent field known as macroelectronics, in which microelectronic devices are distributed yet integrated over large area substrates with sizes much bigger than semiconductor wafers.
Currently, the macroelectronics industry is dramatically growing in the similar way as the microelectronics was in early ’90s. The most visible example of macroelectronics at present is flat-panel displays, which have been rapidly replacing cathode-ray tubes as the monitors of choice for computers and televisions since 2000. The flat-panel displays have enabled applications unimaginable for cathode-ray tubes. For example, the Dolphins Stadium in Miami will soon have the world’s largest high definition video display, about 15 m high and 42 m wide, comprising more than 4.6 million light-emitting diodes, showing image of more than 1.5 million pixels.
While the commercial success of flat-panel display opens an era of large area electronics, other emerging applications, such as rollable display, printable thin-film solar cell and electronic skin, demonstrate further desirable attributes for macroelectronic systems, including flexibility, portability and low-cost. To realize these attributes, a growing trend is to fabricate macroelectronic products directly on flexible substrates, such as polymers. The flat-panel displays currently available in market are fabricated on glass substrates and are fragile. A case in recent news is the cracking of the screens of the iPod nano, a music player that Apple Computer expects to be its best-selling portable device. By contrast, displays made on thin polymer substrates are rugged. Flexible displays of large areas will be lightweight and can be rolled up – they will be portable. For example, in Sept. 2005, Philips Polymer Vision has revealed the world's first prototype of a rollable electronic reader, which can unfold to a 5-inch display and roll back into a pocket-size (100×60×20 mm) device. Furthermore, such thin-film devices on flexible polymer substrates can lend themselves to low-cost fabrication process (i.e., roll-to-roll printing), resulting in lightweight, rugged and flexible macroelectronic products.
http://www.macroelectronics.org: A web portal that tracks latest technological progresses and ongoing scientific researches on macroelectronics. http://en.wikipedia.org/wiki/Macroelectronics

An educational video targeted for middle school aged students. This video is a winning entry for the 2007 Sci/Terp Video competition at University of Maryland, a competition for undergraduates to make a short video that explains their science, engineering, or technology research.

Vedio come from http://www.scivee.tv/node/6286

Vedio come from http://www.youtube.com/watch?v=84lCMgfgXGc.

After making a list of the great engineering achievements of the 20th century, the National Academy of Engineering, of the United States, has recently described a list of the grand challenges for engineering in the 21st century (of no particular order):
Make solar energy economical
Provide energy from fusion
Develop carbon sequestration methods
Manage the nitrogen cycle
Provide access to clean water
Restore and improve urban infrastructure
Advance health informatics
Engineer better medicines
Reverse-engineer the brain
Prevent nuclear terror
Secure cyberspace
Enhance virtual reality
Advance personalized learning
Engineer the tools of scientific discovery
Update on 27 April 2008. The US National Committee on Theoretical and Applied Mechanics would love to hear your thoughts on these challenges.
More detail about the subitemhttp://www.engineeringchallenges.org/cms/challenges.aspx